岸芯科技

Analog in-memory computing AI inference chips based on RRAM memristors (NPU chips and IP) for low-power edge and endpoint AI devices.

Develops edge machine learning chips (MLSoC) and software that enable robots, cars, drones and other devices to run AI locally

Series C · $500M · 2026-09 · Valuation $1.4B

AI chips for edge devices and data centers

Undisclosed · $106M · 2024-05

Design of high-energy-efficiency NPU inference chips for on-device AI

Series A · $140M · 2026-09

In-house 星核 series edge AI chips and embodied intelligence data platform for on-device inference in robots, satellites and drones

Undisclosed · 2026-07

RISC-V automotive-grade chips and embodied AI compute chips for humanoid robots.

Series A · 2026-10

General-purpose reconfigurable RISC-V processor for physical AI (sensing, AI inference and real-time control on a single chip)

Seed · $18M · 2026-10

Compute-in-memory AI inference chips and complete systems for data centers

Series B · $236M · 2026-05

Single-photon avalanche diode (SPAD) image sensor chip design with pixel-level digital computing integrated in the sensor.

Undisclosed · $3M · 2026-08

On-device AI chips (NPUs, or neural processing units), with hardware and software for AI applications in electronic devices

Series C · $80M · 2024-05

RA/RX/RL78/RH850 series MCUs, RZ series MPUs, R-Car automotive SoCs, power management and analog/mixed-signal devices; ships over 3.5 billion units a year, about half for automotive and the rest for industrial, IoT and data center/communications infrastructure; offers on-device machine learning solutions using inference technology from the acquired Reality AI.

Programmable ASICs and rack-scale systems for foundation model inference, using processor-memory co-design to cut energy use

Series A · 2026-09