Denglin Technology

Wafer-scale AI chips and supercomputers, and AI training/inference cloud services based on its own hardware.

Series D+ · $2.9B · 2026-02 · Valuation $23B

Transformer-specific inference ASIC chip (Sohu) and inference servers

Series C · $1.9B · 2026-07 · Valuation $10B

AI inference chips and systems for data centers

Series C · $450M · 2025-11 · Valuation $2.0B

GPGPU chips for large model inference, with in-house cores matching the CUDA programming experience, aimed at lowering inference compute costs

Undisclosed · 2026-09

R&D of general-purpose cloud AI chips (GPU/XPU), providing compute for LLM training and inference.

R&D of fully domestic 3D compute/inference chips, using 3D stacking and new architectures to cut inference costs, with mass production

— · 2026-10 · Valuation $1.7B

Photonic AI inference chip (DX-1/optical tensor processing unit) that uses SRAM plus photonic interconnects to bypass the HBM bottleneck, with accompanying optical networking and rack-scale systems

Series B · $532M · 2026-08 · Valuation $3.3B

Compute-in-memory AI inference chips and complete systems for data centers

Series C · 2026-10 · Valuation $6.5B pre-money

High-performance AI inference chips for automotive, mobile and data center applications

Undisclosed · $46M · 2025-05

Designs the AI inference chip Rebel100 along with companion servers and full racks, for telecom operators and data centers to run agent inference

Pre-IPO · $898M · 2026-03 · Valuation $2.3B

Develops processors and software that enhance AI and machine learning capabilities

Series D+ · $2.3B · 2026-10 · Valuation $6.2B

Develops the RNGD data center inference accelerator card and the WARBOY vision NPU for enterprises running large model inference

Series D+ · $745M · 2026-10 · Valuation $2.9B