Luanqi Technology

Rack-scale integrated cloud computer (full racks of compute, storage and networking with hardware and software designed together)

Series D+ · $833M · 2026-10

Compute-in-memory (CIM) AI memory chips and inference racks that let data centers support more users and longer context at the same power.

NeuCool® two-phase direct-to-chip liquid cooling systems for AI data centers

Series B · $65M · 2026-01

R&D, production and sales of high-purity electronic chemicals such as semiconductor CVD/ALD precursors

2026-10

R&D and manufacturing of semiconductor front-end metrology and inspection equipment (optical/X-ray wafer metrology: film thickness, critical dimension OCD, overlay accuracy, material composition and stress analysis), as well as advanced packaging inspection and high-end scientific instruments

Series B · $138M · 2026-07

Gallium oxide, a fourth-generation semiconductor material

Undisclosed · 2026-08

Cloud infrastructure for AI workloads

Series B · $450M · 2026-09 · Valuation $1.0B

Compute-in-memory AI inference chips and complete systems for data centers

Series B · $236M · 2026-05

Full-stack AI cloud platform: GPU cloud compute, AI training/inference infrastructure and integrated data center plus power services

Debt / Convertible · $3.7B · 2026-09 · Valuation $15B

12-inch single-crystal 2D semiconductor wafer growth platform for next-generation AI and high-performance computing chips

Seed · $15M · 2026-09

MEMS-based silicon clock oscillator chips replacing quartz devices, providing precision timing for AI data centers, consumer electronics and industrial systems.

Series B · $55M · 2026-06

Data center company

Series C · $6.4B · 2026-01