Reexen Technology

Compute-in-memory (CIM) AI memory chips and inference racks that let data centers support more users and longer context at the same power.

Analog/compute-in-memory AI inference chips

Undisclosed · $125M · 2025-12

Develops low-power AI computing products and technology for autonomous vehicles

Undisclosed · $175M · 2024-02

3D compute-in-memory (3D-CIM) AI inference chips

Series C · $154M · 2026-09

3D compute-in-memory AI inference chips: 64 TOPS CIM units with in-house RISC-V vector architecture, 6GB-48GB 3D DRAM

Angel · $15M · 2026-10

3D compute-in-memory chip R&D, focused on native 3D-integration architecture and 3D DRAM stacked memory-compute fusion

Series B · 2026-08

Compute-in-memory AI inference chips and complete systems for data centers

Series B · $236M · 2026-05

System-level software that routes AI workloads to the most suitable models and chips based on cost and latency

Seed · $110M · 2026-08

Photonic AI inference chip (DX-1/optical tensor processing unit) that uses SRAM plus photonic interconnects to bypass the HBM bottleneck, with accompanying optical networking and rack-scale systems

Series B · $532M · 2026-08 · Valuation $3.3B

On-device AI chips (NPUs, or neural processing units), with hardware and software for AI applications in electronic devices

Series C · $80M · 2024-05

Develops near-memory AI inference chips and CXL computational memory products to reduce AI inference cost and power consumption

Series B · $185M · 2026-05 · Valuation $570M

Designs the AI inference chip Rebel100 along with companion servers and full racks, for telecom operators and data centers to run agent inference

Pre-IPO · $898M · 2026-03 · Valuation $2.3B