福联集成

Ayar Labs, founded in 2015 in San Jose, California, develops optical interconnect technology that uses light to transmit data between computer chips to address data transfer bottlenecks in AI systems.

Series D+ · $1.0B · 2026-09 · Valuation $3.8B

CScale, founded in 2023 and headquartered in Palo Alto with ~85 staff and offices in Athens, Bangalore, Taipei and Shanghai, builds an integrated optical light engine for AI scale-up interconnect, replacing copper to link thousands of accelerators with high bandwidth and low latency while containing individual optical-link failures without interrupting compute.

Series C · $188M · 2026-09

Delos Data is a Palo Alto-based AI infrastructure company co-founded in 2025 by former Barefoot Networks and Intel executive Ed Doe and Intel architect Dan Daly. It builds the Delos Nonstop AI product line, including a data interface chip, cluster reference architecture and servers, to remove network and data-movement bottlenecks in agentic AI inference.

Undisclosed · $100M · 2026-09

Founded in 2021, HuaChen Xinguang is an IDM-model developer and manufacturer of high-reliability semiconductor photonic (pump laser) chips used in optical signal amplification for backbone/core/metro networks, submarine fiber, inter-satellite laser links and AI data-center DCI. Mass production is slated for H2 2026.

Undisclosed · 2026-07

Founded in April 2019 and headquartered in Haining, Zhejiang, Guoke Guangxin (CSPC) is a national high-tech enterprise focused on silicon nitride (SiN) photonic chip technology, covering materials, chip design, packaging, optoelectronic devices and system integration. Its products include datacom silicon photonic chips (400G/800G/1.6T), 3.2T/6.4T NPO/CPO and OIO chiplets, tunable narrow-linewidth coherent light sources, and FMCW/dToF solid-state lidar, serving AI clusters, high-speed data centers, fiber sensing and OCT applications. It acquired Dutch coherent laser company CHILAS in 2023; the team numbers 190+ with over 60% in R&D and 250+ patents.

Series B · 2026-09

E芯 Semiconductor (Shenzhen E芯 Semiconductor Technology Co., Ltd.) was established in October 2020, focusing on metrology and inspection equipment for front-end semiconductor wafer manufacturing using optical and X-ray technologies. Its products cover process control aspects such as film thickness, critical dimension, overlay, non-destructive elemental analysis, and stress, and extend to advanced packaging inspection and high-end scientific instruments, positioning itself as infrastructure for AI chip manufacturing yield control. It is a national specialized, refined, and innovative 'Little Giant' enterprise, with nearly 300 employees and a R&D ratio of about 60%, with R&D backbone mainly consisting of alumni from USTC. It completed a near-100 million RMB Series B+ round in July 2026 (led by Guoxin Fund, Kunpeng Capital, Hillhouse Capital, Yizhuang Guotou, and Zhongxin Juyuan), one of the largest single rounds in domestic semiconductor equipment in 2026.

Series B · $138M · 2026-07

Salience Labs is a silicon photonics company spun out of research at the University of Oxford and the University of Münster. It develops all-optical circuit switching chips and switch modules that connect large numbers of GPUs in AI data centers optically, replacing power-hungry transceiver-plus-electrical switching to cut latency, power and cost.

Series B · 2026-10

Aylight, a spinout from ETH Zürich, develops chip-scale multi-wavelength lasers using a frequency-modulated optical frequency comb (FM comb) architecture that generates multiple precisely spaced wavelengths from a single chip, targeting optical interconnects for AI data centers and high-precision FMCW sensing. Headquartered in Zurich, Switzerland.

Pre-Seed · $5M · 2026-07

Olix, founded in 2024 in London, develops photonic AI chips targeting inference workloads to reduce high-bandwidth memory constraints.

Series B · $532M · 2026-08 · Valuation $3.3B

Xsight Labs , a nine-year-old Tel Aviv startup that makes programmable data processing units and Ethernet switches for AI and cloud data center networks, raised a $300+ million round at a $2.8 billion post-money valuation. Fidelity was the deal lead, with Aliya Capital Partners, Atreides Management, Artisan Partners, Battery Ventures, Diagonal Capital, Intel Capital, Key1 Capital, Maverick Capital, Sienna, T. Rowe Price, Union Group , and Valor Equity Partners also participating. More here .

Series D+ · $300M · 2026-07 · Valuation $2.8B

Phasetrum Inc. is a fabless RF IC design house in Hsinchu specializing in phased-array and beamforming chips from X-band to sub-THz (roughly 10–90GHz). Spun out of National Yang Ming Chiao Tung University in 2023, it offers scalable antenna-in-package (AiP), phase tuner and compact frequency extender chips plus on-wafer OTA measurement services for LEO satellite communication, AESA/automotive radar and drone radar/communication.

Nexstrom, founded in 2024 in Singapore, is a deep-tech semiconductor materials company building a platform to grow 12-inch (300mm) single-crystal 2D semiconductor (transition-metal dichalcogenide) wafers on production-ready manufacturing tools for next-generation AI and high-performance computing chips, as a scalable complement to silicon. Its customers are semiconductor foundries, some already testing wafer and material samples; the company aims to take 2D materials from lab-scale demos to fab-grade manufacturing.

Seed · $15M · 2026-09