澜昆微电子

Silicon photonics integrated electro-optic modulator materials and optical engines

Series B · 2026-09

Development of an AI infrastructure connectivity platform

Series C · $900M · 2026-08 · Valuation $5.5B

Provides co-packaged optics (CPO) interconnect chips for AI data center accelerator clusters, replacing copper interconnects with optical interconnects

Series D+ · $1.0B · 2026-09 · Valuation $3.8B

SiN silicon photonics: 400G-1.6T datacom chips, 3.2T/6.4T NPO/CPO and OIO chiplets for AI; chips for LiDAR, coherent, sensing, OCT

Series B · 2026-09

Silicon photonic integrated circuit (PIC/OIO/CPO) R&D

Angel · $7M · 2026-07

High-speed optical and electrical interconnect chips for AI data centers (optical CDR/oDSP, electrical AEC/ACC), built on in-house SerDes

Series A · $28M · 2026-07

Chip-scale multi-wavelength lasers for optical interconnects in AI data centers (silicon photonics).

Pre-Seed · $5M · 2026-07

All-optical circuit switching chips and modules (32-port OC-32M commercial module, 64-port prototype, 128/256-port planned) for AI cluster scale-out networking and hyperscale cloud data centers; manufacturing and ecosystem partners include Tower Semiconductor and Keysight.

Series B · 2026-10

Chip-scale multi-wavelength comb lasers for optical interconnects in data centers and AI clusters

Undisclosed · $15M · 2025-12

Silicon nitride photonic integrated chips and integrated frequency combs for AI data centers and telecom

Seed · 2026-08

High-power multi-wavelength laser light sources for AI data center optical interconnects and CPO

Undisclosed · 2026-10

Fabless semiconductor company providing programmable Ethernet switch chips and 800G data processing units (DPUs) for hyperscale, edge and AI data center networks.

Series D+ · $300M · 2026-07 · Valuation $2.8B