Samsung Semiconductor
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Samsung Semiconductor, Inc. is the U.S. semiconductor subsidiary of Samsung Electronics, headquartered in San Jose, California.
About
Samsung Semiconductor, Inc. is the U.S. semiconductor subsidiary of Samsung Electronics, headquartered in San Jose, California. It leads Samsung's U.S. memory (DRAM, NAND/SSD, HBM), foundry and System LSI operations, covering R&D, customer engagement and sales for hyperscale data center, automotive, IoT, mobile and consumer electronics customers. Its parent Samsung Electronics is headquartered in Suwon, South Korea and listed on the Korea Exchange.
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Founders / team· 2
Comparable companies· by market
This company
BusinessLatest roundTotal raisedDate- Samsung Semiconductor
Samsung Semiconductor, Inc. is the U.S. semiconductor subsidiary of Samsung Electronics, headquartered in San Jose, California.
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United States
BusinessLatest roundTotal raisedDate- CIMTech
Compute-in-memory (CIM) AI memory chips and inference racks that let data centers support more users and longer context at the same power.
— - Vertical Semiconductor
Vertically stacked GaN chips to improve power delivery efficiency in AI data centers
Seed · $11M · 2025-10
$11M - D-Matrix
AI inference chips and systems for data centers
Series C · $450M · 2025-11 · Valuation $2.0B
$450MValuation $2.0B
China
BusinessLatest roundTotal raisedDate- ChangXin Memory Technologies
DRAM chip design and manufacturing (DDR4/DDR5, LPDDR5X, HBM in development); China's largest and the world's fourth-largest DRAM maker
IPO · 2026-07
— - Rhinoptix
Thin-film lithium niobate photonic chips (comb sources, EO and coherent IQ modulation, photonic engines) for AI data center optics
Series A · 2026-09
— - 亿铸科技
Memristor-based fully digital compute-in-memory high-performance AI chips for data centers and cloud servers
Series A · 2024-10
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Europe
BusinessLatest roundTotal raisedDate- VSORA
High-performance AI inference chips for automotive, mobile and data center applications
Undisclosed · $46M · 2025-05
$46M - Kandou AI
Company developing high-bandwidth connectivity chips for GPU interconnects in AI data centers
Series A · $551M · 2026-03
$551M - Fractile
Compute-in-memory AI inference chips and complete systems for data centers
Series C · 2026-10 · Valuation $6.5B pre-money
—Valuation $6.5B pre-money
Other / unspecified
BusinessLatest roundTotal raisedDate- Rebellions
Designs the AI inference chip Rebel100 along with companion servers and full racks, for telecom operators and data centers to run agent inference
Pre-IPO · $898M · 2026-03 · Valuation $2.3B
$898MValuation $2.3B - Stathera
MEMS-based silicon clock oscillator chips replacing quartz devices, providing precision timing for AI data centers…
Series B · $55M · 2026-06
$55M - Renesas Electronics
RA/RX/RL78/RH850 series MCUs, RZ series MPUs, R-Car automotive SoCs…
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