源归材料

E芯 Semiconductor (Shenzhen E芯 Semiconductor Technology Co., Ltd.) was established in October 2020, focusing on metrology and inspection equipment for front-end semiconductor wafer manufacturing using optical and X-ray technologies. Its products cover process control aspects such as film thickness, critical dimension, overlay, non-destructive elemental analysis, and stress, and extend to advanced packaging inspection and high-end scientific instruments, positioning itself as infrastructure for AI chip manufacturing yield control. It is a national specialized, refined, and innovative 'Little Giant' enterprise, with nearly 300 employees and a R&D ratio of about 60%, with R&D backbone mainly consisting of alumni from USTC. It completed a near-100 million RMB Series B+ round in July 2026 (led by Guoxin Fund, Kunpeng Capital, Hillhouse Capital, Yizhuang Guotou, and Zhongxin Juyuan), one of the largest single rounds in domestic semiconductor equipment in 2026.

Nexstrom, founded in 2024 in Singapore, is a deep-tech semiconductor materials company building a platform to grow 12-inch (300mm) single-crystal 2D semiconductor (transition-metal dichalcogenide) wafers on production-ready manufacturing tools for next-generation AI and high-performance computing chips, as a scalable complement to silicon. Its customers are semiconductor foundries, some already testing wafer and material samples; the company aims to take 2D materials from lab-scale demos to fab-grade manufacturing.

Founded in December 2019 in Hangzhou by a team from the Chinese Academy of Sciences' Shanghai Institute of Optics and Fine Mechanics, Fujia Gallium industrializes ultra-wide-bandgap gallium oxide (Ga2O3) semiconductor materials, covering single-crystal substrates, MOCVD/MBE epitaxial wafers and crystal-growth equipment. It is the only company publicly reported to have achieved 12-inch Ga2O3 single-crystal growth, and pioneered AI-assisted crystal growth (one-click growth, >90% yield) with a US patent on deep-learning-based conductive gallium oxide quality prediction.

Xincheng Microelectronics (Xjc), founded in June 2015 in Hefei, Anhui, specializes in semiconductor direct-write lithography equipment and PCB direct imaging equipment. By 2025 revenue, it is the world's largest supplier of PCB direct imaging equipment. The company listed on the STAR Market in 2021 (688630) and completed an A+H dual listing on the Hong Kong Stock Exchange on June 26, 2026.

Fab2, formerly Atomic Semi, designs and builds every piece of equipment inside a semiconductor fab in-house and assembles compact, repeatable mini-fabs it can mass-produce — a 'fab fab'.

Founded in December 2024 (formerly Nanjing Bowei Semiconductor) and relocated to Changzhou Wujin Hi-Tech Zone, Jianxin Semiconductor Equipment develops back-end inspection and sorting equipment for advanced semiconductor packaging, offering integrated AOI (automated optical inspection), IR crack detection and auto sorting/taping machines for yield control and die sorting.