AaltoSemi
芯爱科技
AaltoSemi (Xin'ai Technology, Nanjing), founded in 2021 in Nanjing's Pukou Economic Development Zone, supplies high-end IC packaging substrates including ETS, Coreless, Build-up, FC-CSP, BT, ABF and FCBGA substrates for mobile APs, memory, edge AI and CPU/GPU/ASIC packaging.
Position in SVTRnew
Snapshot 2026-10-19- Startup SignalsTop 25%
- ComputeTop 25%
- ChipsTop 25%
About
AaltoSemi (Xin'ai Technology, Nanjing), founded in 2021 in Nanjing's Pukou Economic Development Zone, supplies high-end IC packaging substrates including ETS, Coreless, Build-up, FC-CSP, BT, ABF and FCBGA substrates for mobile APs, memory, edge AI and CPU/GPU/ASIC packaging. Its products are qualified by JCET, Huatian, Forehope, ASE and SPIL, with volume production since April 2024.
Full tier & rationale — an SVTR Intelligence benefit
Capital graph
Founders / core team
Investors
Funding history
Similar companies· Same sector “Compute”
ChangXin Memory Technologies
ComputeCXMT (ChangXin Memory Technologies), founded in 2016 and headquartered in Hefei, is the first company in mainland China to achieve mass production of DRAM chips and the largest vertically integrated DRAM R&D, design, and manufacturing company in China. The company operates its own 12-inch wafer fab, with products covering mainstream DRAM types including DDR and LPDDR, serving customers in consumer electronics, server, and mobile device sectors.
SG Micro Corp
ComputeShengbang Semiconductor (SGMICRO), founded in 2007 in Beijing, designs and sells analog integrated circuits including signal chain and power management chips. It is a leading domestic analog chip design company and the first A-share listed firm focused exclusively on analog chip design (SZSE ChiNext: 300661). In June 2026, it completed an A+H dual listing on the Hong Kong Stock Exchange at an issue price of HKD 85.20, raising up to approximately HKD 4.601 billion.
Hefei SinoMicroelectronics Equipment
ComputeXincheng Microelectronics (Xjc), founded in June 2015 in Hefei, Anhui, specializes in semiconductor direct-write lithography equipment and PCB direct imaging equipment. By 2025 revenue, it is the world's largest supplier of PCB direct imaging equipment. The company listed on the STAR Market in 2021 (688630) and completed an A+H dual listing on the Hong Kong Stock Exchange on June 26, 2026.
Eliyan
ComputeEliyan, founded in 2021 in Silicon Valley, USA, develops chiplet interconnect technology to accelerate AI chip processing speeds. In addition to chip-to-chip interconnects in chiplet-based designs, the company addresses growing memory capacity and bandwidth challenges in AI chips through its Universal Memory Interface (UMI). Its bidirectional interconnect approach targets the memory wall problem in large multi-chiplet designs, delivering up to 4x the performance of competing solutions at half the power consumption.
Angstrom Excellence
ComputeE芯 Semiconductor (Shenzhen E芯 Semiconductor Technology Co., Ltd.) was established in October 2020, focusing on metrology and inspection equipment for front-end semiconductor wafer manufacturing using optical and X-ray technologies. Its products cover process control aspects such as film thickness, critical dimension, overlay, non-destructive elemental analysis, and stress, and extend to advanced packaging inspection and high-end scientific instruments, positioning itself as infrastructure for AI chip manufacturing yield control. It is a national specialized, refined, and innovative 'Little Giant' enterprise, with nearly 300 employees and a R&D ratio of about 60%, with R&D backbone mainly consisting of alumni from USTC. It completed a near-100 million RMB Series B+ round in July 2026 (led by Guoxin Fund, Kunpeng Capital, Hillhouse Capital, Yizhuang Guotou, and Zhongxin Juyuan), one of the largest single rounds in domestic semiconductor equipment in 2026.
Overlord Labs
ComputeOverlord Labs, founded in 2025 and based in San Jose, California, is a fabless semiconductor company whose GENESIS Battery Intelligence IC integrates battery intelligence algorithms into silicon for edge AI devices such as smart glasses, wearables and hearables, targeting Tier-1 OEMs with volume production planned for 1H 2027.
Investors that may fit
Shenzhen Capital Group
11 Compute deals in the last 24 months · 7 at a nearby stage · 11 in 东亚
Request intro →Ranked by each firm’s deals in this sector over the last 24 months, weighted by nearby stage and shared geography. Indicative only — no rating judgment.