中科卓尔

Incubated at Princeton University; develops analog in-memory computing AI chips that significantly reduce energy consumption and support AI processing on local devices

Series B · $123M · 2025-02

AI chips for autonomous vehicles

Series B · $49M · 2023-09

AI inference cloud built around ASIC chips

Series A · $115M · 2026-10 · Valuation $800M

R&D and manufacturing of semiconductor front-end metrology and inspection equipment (optical/X-ray wafer metrology: film thickness, critical dimension OCD, overlay accuracy, material composition and stress analysis), as well as advanced packaging inspection and high-end scientific instruments

Series B · $138M · 2026-07

High-performance edge/on-device AI inference chip design; open computing platform for agentic intelligence

Angel · $100M · 2026-09

Reconfigurable dataflow CAISA AI chips and 星空 edge computing devices for AI video analytics in energy, safety oversight and transportation

Series C · $82M · 2024-01

Develops low-power memory chips and memory IP for AI compute workloads

Series C · $116M · 2025-11

System-level software that routes AI workloads to the most suitable models and chips based on cost and latency

Seed · $110M · 2026-08

High-performance AI inference chips for automotive, mobile and data center applications

Undisclosed · $46M · 2025-05

MEMS-based silicon clock oscillator chips replacing quartz devices, providing precision timing for AI data centers, consumer electronics and industrial systems.

Series B · $55M · 2026-06

12-inch single-crystal 2D semiconductor wafer growth platform for next-generation AI and high-performance computing chips

Seed · $15M · 2026-09

Develops the RNGD data center inference accelerator card and the WARBOY vision NPU for enterprises running large model inference

Series C · $125M · 2025-08