Angstrom Excellence
埃芯半导体
E芯 Semiconductor (Shenzhen E芯 Semiconductor Technology Co., Ltd.) was established in October 2020, focusing on metrology and inspection equipment for front-end semiconductor wafer manufacturing using optical and X-ray technologies.
Position in SVTR
Snapshot 2026-10-29- Startup SignalsTop 10%↓2
- ComputeTop 25%↓3
- ChipsTop 25%↓3
- Semiconductor Equipment#3of 16↓1
About
E芯 Semiconductor (Shenzhen E芯 Semiconductor Technology Co., Ltd.) was established in October 2020, focusing on metrology and inspection equipment for front-end semiconductor wafer manufacturing using optical and X-ray technologies. Its products cover process control aspects such as film thickness, critical dimension, overlay, non-destructive elemental analysis, and stress, and extend to advanced packaging inspection and high-end scientific instruments, positioning itself as infrastructure for AI chip manufacturing yield control. It is a national specialized, refined, and innovative 'Little Giant' enterprise, with nearly 300 employees and a R&D ratio of about 60%, with R&D backbone mainly consisting of alumni from USTC. It completed a near-100 million RMB Series B+ round in July 2026 (led by Guoxin Fund, Kunpeng Capital, Hillhouse Capital, Yizhuang Guotou, and Zhongxin Juyuan), one of the largest single rounds in domestic semiconductor equipment in 2026.
Full tier & rationale — an SVTR Intelligence benefit
Capital graph
Company· 12
Investor· 10
Founders / team· 1
Funding history
- 2026-07-29Series B+$138M
Investors · 国新基金, 鲲鹏资本, GL Ventures, E-Town Capital, 赛米基金, 建信股权, China Fortune-Tech Capital, 穗开投资, 武创投, 华工投资, 深担创投, 合肥高投, 光谷金控Source · news.pedaily.cn ↗
Comparable companies· by market
This company
BusinessLatest roundTotal raisedDate- Angstrom Excellence
R&D and manufacturing of semiconductor front-end metrology and inspection equipment (optical/X-ray wafer metrology: film thickness, critical dimension OCD, overlay accuracy, material composition and stress analysis), as well as advanced packaging inspection and high-end scientific instruments
Series B · $138M · 2026-07
$138M
United States
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Agentic AI chip design environment for semiconductor companies that uses autonomous AI agents to turn design specifications and code into production-ready RTL and verification assets and to automate defect root-cause analysis
Series A2 · $134M · 2026-07
$134M - Ricursive Intelligence
Builds a frontier AI platform for full-flow semiconductor design optimization
Series A · $370M · 2026-02 · Valuation $4.0B
$370MValuation $4.0B - Substrate
Particle accelerator-based semiconductor manufacturing processes
Series A · $100M · 2025-11
$100M
China
BusinessLatest roundTotal raisedDate- 青禾晶元
Qinghe Jingyuan is a Beijing-based semiconductor bonding equipment and process provider founded in July 2020. It builds ultra-high-vacuum room-temperature bonding, hybrid bonding and thermocompression bonding tools plus surface treatment equipment for 4- to 12-inch wafers, and offers bonding process services, serving chiplet and 2.5D/3D advanced packaging, HBM, compound-semiconductor heterogeneous integration and MEMS.
Pre-IPO · $139M · 2026-10
$139M - 常州鉴芯半导体设备有限公司
Integrated back-end AOI inspection and automated sorting equipment for advanced packaging
Angel · 2026-08
— - Hangzhou Fujia Gallium Industry Technology
Gallium oxide, a fourth-generation semiconductor material
Undisclosed · 2026-08
—
Europe
BusinessLatest roundTotal raisedDate- Nearfield Instruments
Advanced semiconductor 3D metrology and inspection equipment that measures nanoscale 3D structures on wafers and detects defects in volume production
Series D+ · $380M · 2026-06 · Valuation $1.6B
$380MValuation $1.6B - Fractile
Compute-in-memory AI inference chips and complete systems for data centers
Series B · $236M · 2026-05
$236M - Black Semiconductor
Its products integrate graphene-based photonic interconnect technology
Series A · $275M · 2024-06
$275M
Other / unspecified
BusinessLatest roundTotal raisedDate- Nexstrom
12-inch single-crystal 2D semiconductor wafer growth platform for next-generation AI and high-performance computing chips
Seed · $15M · 2026-09
$15M - Xsight Labs
Fabless semiconductor company providing programmable Ethernet switch chips and 800G data processing units (DPUs) for hyperscale, edge and AI data center networks.
Series D+ · $300M · 2026-07 · Valuation $2.8B
$300MValuation $2.8B - XCENA
Develops near-memory AI inference chips and CXL computational memory products to reduce AI inference cost and power consumption
Series B · $185M · 2026-05 · Valuation $570M
$185MValuation $570M
Confirmed rounds only. Matched on subsector, sector, stage and funding scale — each verifiable on the company profiles.
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