AaltoSemi
芯爱科技
AaltoSemi (Xin'ai Technology, Nanjing), founded in 2021 in Nanjing's Pukou Economic Development Zone, supplies high-end IC packaging substrates including ETS, Coreless, Build-up, FC-CSP, BT, ABF and FCBGA substrates for mobile APs, memory, edge AI and CPU/GPU/ASIC packaging.
Position in SVTRnew
Snapshot 2026-10-20- Startup SignalsTop 25%
- ComputeTop 25%
- ChipsTop 25%
About
AaltoSemi (Xin'ai Technology, Nanjing), founded in 2021 in Nanjing's Pukou Economic Development Zone, supplies high-end IC packaging substrates including ETS, Coreless, Build-up, FC-CSP, BT, ABF and FCBGA substrates for mobile APs, memory, edge AI and CPU/GPU/ASIC packaging. Its products are qualified by JCET, Huatian, Forehope, ASE and SPIL, with volume production since April 2024.
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Capital graph
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Investors
Funding history
Comparable companies· by market
In commonSame subsector: Chips
MostSimilar total funding
United States
Latest roundTotal raisedDate- Eliyan
Series C · $295M · 2026-07 · Valuation $1.0B
- Latest round
- Series C
- Total raised
- $295M
- Valuation $1.0B
- Date
- 2026-07
- Fab2Also at Series A
Series A · $515M · 2026-09 · Valuation $3.7B
- Latest round
- Series A
- Total raised
- $515M
- Valuation $3.7B
- Date
- 2026-09
- Velaura AIAlso at Series A
Series A · $424M · 2026-08 · Valuation $1.0B
- Latest round
- Series A
- Total raised
- $424M
- Valuation $1.0B
- Date
- 2026-08
China
Latest roundTotal raisedDateEurope
Latest roundTotal raisedDateOther / unspecified
Latest roundTotal raisedDateConfirmed rounds only. Matched on subsector, sector, stage and funding scale — each verifiable on the company profiles.
Investors that may fit
Shenzhen Capital Group
11 Compute deals in the last 24 months · 7 at a nearby stage · 11 in 东亚
Request intro →Ranked by each firm’s deals in this sector over the last 24 months, weighted by nearby stage and shared geography. Indicative only — no rating judgment.