About
Engitist develops and manufactures semiconductor optical metrology and inspection equipment—thin-film, OCD and advanced-packaging 3D/2D inspection systems—headquartered in Shanghai Lingang.
Full tier & rationale — an SVTR Intelligence benefit
Capital graph
Investor· 5
Funding history
- 2026-10-29Series C数亿人民币
Investors · GP Capital, 陕投集团, Stony Creek Capital, China Fortune-Tech Capital, 超越创投Source · vc.pedaily.cn ↗
Comparable companies· by market
This company
BusinessLatest roundTotal raisedDate- Engitist
Engitist develops and manufactures semiconductor optical metrology and inspection equipment—thin-film, OCD and advanced-packaging 3D/2D inspection systems—headquartered in Shanghai Lingang.
Series C · $46M · 2026-10
$46M
United States
BusinessLatest roundTotal raisedDate- ChipAgents
Agentic AI chip design environment for semiconductor companies that uses autonomous AI agents to turn design specifications and code into production-ready RTL and verification assets and to automate defect root-cause analysis
Series A2 · $134M · 2026-07
$134M - Substrate
Particle accelerator-based semiconductor manufacturing processes
Series A · $100M · 2025-11
$100M - EnCharge AI
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Series B · $123M · 2025-02
$123M
China
BusinessLatest roundTotal raisedDate- Angstrom Excellence
R&D and manufacturing of semiconductor front-end metrology and inspection equipment (optical/X-ray wafer metrology: film thickness, critical dimension OCD, overlay accuracy, material composition and stress analysis), as well as advanced packaging inspection and high-end scientific instruments
Series B · $138M · 2026-07
$138M - 青禾晶元
Wafer/chip bonding equipment and precision bonding process services for advanced packaging, HBM and compound semiconductor heterogeneous integration
Pre-IPO · $139M · 2026-10
$139M - 常州鉴芯半导体设备有限公司
Integrated back-end AOI inspection and automated sorting equipment for advanced packaging
Angel · 2026-08
—
Europe
BusinessLatest roundTotal raisedDate- Nearfield Instruments
Advanced semiconductor 3D metrology and inspection equipment that measures nanoscale 3D structures on wafers and detects defects in volume production
Series D+ · $380M · 2026-06 · Valuation $1.6B
$380MValuation $1.6B - Ferroelectric Memory Company
Develops low-power memory chips and memory IP for AI compute workloads
Series C · $116M · 2025-11
$116M - Callosum
System-level software that routes AI workloads to the most suitable models and chips based on cost and latency
Seed · $110M · 2026-08
$110M
Other / unspecified
BusinessLatest roundTotal raisedDate- Nexstrom
12-inch single-crystal 2D semiconductor wafer growth platform for next-generation AI and high-performance computing chips
Seed · $15M · 2026-09
$15M - DEEPX
On-device AI chips (NPUs, or neural processing units), with hardware and software for AI applications in electronic devices
Series C · $80M · 2024-05
$80M - EdgeCortix
Energy-efficient edge AI inference chips and systems
Series B · $130M · 2025-11
$130M
Confirmed rounds only. Matched on subsector, sector, stage and funding scale — each verifiable on the company profiles.
Investors that may fit
CAS Star
11 Compute deals in the last 24 months · 1 at a nearby stage · 11 in East China
Request intro →Shenzhen Capital Group
11 Compute deals in the last 24 months · 4 at a nearby stage · 11 in East China
Request intro →GL Ventures
7 Compute deals in the last 24 months · 2 at a nearby stage · 7 in East China
Request intro →Bosch Ventures
7 Compute deals in the last 24 months · 3 at a nearby stage · 1 in East China
Request intro →Menlo Ventures
6 Compute deals in the last 24 months · 4 at a nearby stage · 1 in East China
Request intro →T-Capital
6 Compute deals in the last 24 months · 1 at a nearby stage · 6 in East China
Request intro →Ranked by each firm’s deals in this sector over the last 24 months, weighted by nearby stage and shared geography. Indicative only — no rating judgment.