About
Shanghai Bangxin Semiconductor Technology, founded in 2020 and based in Lingang, Shanghai, develops front-end semiconductor process equipment (etch, strip/ashing, thin-film deposition) in 6/8/12-inch formats for compound semiconductor, IC, packaging and panel makers, including major Chinese wafer fabs and memory chipmakers.
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This company
BusinessLatest roundTotal raisedDate- Bangxin Semiconductor
Shanghai Bangxin Semiconductor Technology, founded in 2020 and based in Lingang, Shanghai, develops front-end semiconductor process equipment (etch…
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United States
BusinessLatest roundTotal raisedDate- Discovered Materials
AI agents to discover new semiconductor chip materials and speed their R&D and commercialization, starting with thermal management materials.
Seed · 2026-08
— - Fab2
Develops a full suite of fab equipment in-house and mass-produces replicable small-scale fabs (fab fab)
Series A · $515M · 2026-09 · Valuation $3.7B
$515MValuation $3.7B - Substrate
Particle accelerator-based semiconductor manufacturing processes
Series A · $100M · 2025-11
$100M
China
BusinessLatest roundTotal raisedDate- Angstrom Excellence
R&D and manufacturing of semiconductor front-end metrology and inspection equipment (optical/X-ray wafer metrology: film thickness…
Series B · $138M · 2026-07
$138M - 青禾晶元
Wafer/chip bonding equipment and precision bonding process services for advanced packaging, HBM and compound semiconductor heterogeneous integration
Pre-IPO · $139M · 2026-10
$139M - Engitist
Semiconductor optical metrology and inspection equipment (thin-film metrology, OCD metrology, advanced packaging inspection)
Series C · $46M · 2026-10
$46M
Europe
BusinessLatest roundTotal raisedDate- Nearfield Instruments
Advanced semiconductor 3D metrology and inspection equipment that measures nanoscale 3D structures on wafers and detects defects in volume production
Series D+ · $380M · 2026-06 · Valuation $1.6B
$380MValuation $1.6B - TUSK IC
Ka-band satellite communication beamforming chips and antenna modules designed on standard CMOS processes
Series A · 2026-09
— - Compound Hound
R&D of semiconductor-related electronic measurement / test equipment (early stage, specific products undisclosed)
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Other / unspecified
BusinessLatest roundTotal raisedDate- Nexstrom
12-inch single-crystal 2D semiconductor wafer growth platform for next-generation AI and high-performance computing chips
Seed · $15M · 2026-09
$15M - Fractal Semiconductor
AI-driven platform for inverse simulation and discovery of chip manufacturing processes
— - Tenstorrent
Develops processors and software that enhance AI and machine learning capabilities
Series D+ · $2.3B · 2026-10 · Valuation $6.2B
$2.3BValuation $6.2B
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