青禾晶元
Qinghe Jingyuan is a Beijing-based semiconductor bonding equipment and process provider founded in July 2020.
Position in SVTR
Snapshot 2026-10-29- Startup SignalsTop 50%new
- ComputeRankedof 205
- ChipsTop 50%
- Semiconductor Equipment#6of 16
About
Qinghe Jingyuan is a Beijing-based semiconductor bonding equipment and process provider founded in July 2020. It builds ultra-high-vacuum room-temperature bonding, hybrid bonding and thermocompression bonding tools plus surface treatment equipment for 4- to 12-inch wafers, and offers bonding process services, serving chiplet and 2.5D/3D advanced packaging, HBM, compound-semiconductor heterogeneous integration and MEMS.
Full tier & rationale — an SVTR Intelligence benefit
Capital graph
Company· 12
Investor· 10
Founders / team· 1
Funding history
- 2026-10-28Pre-IPO
Investors · Inno-Chip, 襄聚投资, 晶耀基金, 芯联集成, 四川发展, 中微公司, 俱成资本, Cowin Capital, Inno Angel Fund, 芯动能投资, 正为资本, V Fund, 清科母基金, 建信投资, 天创资本, 清科产投, 沃赋资本Source · stock.10jqka.com.cn ↗
Comparable companies· by market
This company
BusinessLatest roundTotal raisedDate- 青禾晶元
Qinghe Jingyuan is a Beijing-based semiconductor bonding equipment and process provider founded in July 2020. It builds ultra-high-vacuum room-temperature bonding, hybrid bonding and thermocompression bonding tools plus surface treatment equipment for 4- to 12-inch wafers, and offers bonding process services, serving chiplet and 2.5D/3D advanced packaging, HBM, compound-semiconductor heterogeneous integration and MEMS.
Pre-IPO · $139M · 2026-10
$139M
United States
BusinessLatest roundTotal raisedDate- ChipAgents
Agentic AI chip design environment for semiconductor companies that uses autonomous AI agents to turn design specifications and code into production-ready RTL and verification assets and to automate defect root-cause analysis
Series A2 · $134M · 2026-07
$134M - Substrate
Particle accelerator-based semiconductor manufacturing processes
Series A · $100M · 2025-11
$100M - Ricursive Intelligence
Builds a frontier AI platform for full-flow semiconductor design optimization
Series A · $370M · 2026-02 · Valuation $4.0B
$370MValuation $4.0B
China
BusinessLatest roundTotal raisedDate- Angstrom Excellence
R&D and manufacturing of semiconductor front-end metrology and inspection equipment (optical/X-ray wafer metrology: film thickness, critical dimension OCD, overlay accuracy, material composition and stress analysis), as well as advanced packaging inspection and high-end scientific instruments
Series B · $138M · 2026-07
$138M - 常州鉴芯半导体设备有限公司
Integrated back-end AOI inspection and automated sorting equipment for advanced packaging
Angel · 2026-08
— - Hefei SinoMicroelectronics Equipment
R&D, manufacturing and sales of semiconductor direct-write lithography equipment, PCB direct imaging equipment and automated line systems.
$416M
$416M
Europe
BusinessLatest roundTotal raisedDate- Nearfield Instruments
Advanced semiconductor 3D metrology and inspection equipment that measures nanoscale 3D structures on wafers and detects defects in volume production
Series D+ · $380M · 2026-06 · Valuation $1.6B
$380MValuation $1.6B - Black Semiconductor
Its products integrate graphene-based photonic interconnect technology
Series A · $275M · 2024-06
$275M - Fractile
Compute-in-memory AI inference chips and complete systems for data centers
Series B · $236M · 2026-05
$236M
Other / unspecified
BusinessLatest roundTotal raisedDate- Nexstrom
12-inch single-crystal 2D semiconductor wafer growth platform for next-generation AI and high-performance computing chips
Seed · $15M · 2026-09
$15M - Stathera
MEMS-based silicon clock oscillator chips replacing quartz devices, providing precision timing for AI data centers, consumer electronics and industrial systems.
Series B · $55M · 2026-06
$55M - Xsight Labs
Fabless semiconductor company providing programmable Ethernet switch chips and 800G data processing units (DPUs) for hyperscale, edge and AI data center networks.
Series D+ · $300M · 2026-07 · Valuation $2.8B
$300MValuation $2.8B
Confirmed rounds only. Matched on subsector, sector, stage and funding scale — each verifiable on the company profiles.
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